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rev 1.0 7/12 copyright ? 2012 by silicon laboratories SI4355 SI4355 e asy - to -u se , l ow -c urrent ook/(g)fsk s ub -gh z r eceiver features applications description silicon laboratories? si 4355 is an easy to use, low current, sub-ghz ezradio ? receiver. covering all major bands, it combines plug-and-play simplicity with the flexibility needed to handle a wide variety of applications. the compact 3x3 mm package size combined with a low external bom count makes the SI4355 both space efficient and cost effective. excellent sensitivity of 116 dbm allows for a longer operating range, while the low current cons umption of 10 ma active and 50 na standby, provides for superior battery life. by fully integrating all components from the antenna to the gpio or spi interface to the mcu, the SI4355 makes realizing this performance in an application easy. design simplicity is furt her exemplified in the wi reless development suite (wds) user interface module. this configuration module provides simplified programming options for a broad range of applications in an easy to use format that results in both a faster and lower risk development. like all silicon labor atories? ezradio devices, the SI4355 is fully compliant with all worldwide regulatory standards, such as fcc, etsi, and arib. ? frequency range = 283?960 mhz ? receive sensitivity =?116dbm ? modulation ?? (g)fsk ?? ook ? low rx current = 10 ma ? low standby current = 50 na ? max data rate = 500 kbps ? power supply = 1.8 to 3.6 v ? 64 byte fifo ? auto frequency control (afc) ? automatic gain control (agc) ? integrated battery voltage sensor ? packet handling including preamble, sync word detection, and crc ? low bom ? 20-pin 3x3 mm qfn package ? remote control ? home security and alarm ? te l e m e t r y ? garage and gate openers ? remote keyless entry ? home automation ? industrial control ? sensor networks ? health monitors patents pending pin assignments 1 2 3 4 5 6 7 8 9 10 16 15 14 13 12 11 20 19 18 17 gnd sdn rxp rxn nc gnd nsel sdi sdo sclk nirq gpio1 vdd vdd gnd gpio0 gpio3 gpio2 xin xout
SI4355 2 rev 1.0 functional block diagram rx modem synthesizer lna pga adc rx chain spi interface controller battery voltage sensor aux adc 25-32mhz xo sdn rxp rxn vdd gpio0 gpio1 nsel sdi sdo sclk nirq xout xin gpio2 gpio3
SI4355 rev 1.0 3 t able of c ontents section page 1. electrical specificat ions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.1. definition of test conditi ons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 2. typical applications circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0 3. functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.1. overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.2. receiver chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 3.3. receiver modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4. synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 3.5. crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6. battery voltage and aux iliary adc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4. configuration op tions and user interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.1. ezconfig gui . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 4.2. configuration options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.3. configuration commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5. controller interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.1. serial peripheral interfac e (spi) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2. operating modes and timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.3. application programming interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5.4. interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 5.5. gpio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6. data handling and packet handl er . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 6.1. rx fifo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 6.2. packet handler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 7. pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8. ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 9. package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 10. pcb land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 11. top marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 11.1. SI4355 top marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 11.2. top marking explana tion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 contact information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
SI4355 4 rev 1.0 1. electrical specifications table 1. recommended operating conditions parameter symbol test condition min typ max unit ambient temperature t a ?40 25 85 ? c supply voltage v dd 1.8 3.6 v i/o drive voltage v gpio 1.8 3.6 v table 2. dc characteristics 1 parameter symbol conditions min typ max units supply voltage range v dd 1.8 3.3 3.6 v power saving modes i shutdown rc oscillator, main digital regulator, and low power digital regulator off ?30 ? na i standby register values maintained and rc oscillator/wut off ?50 ? na i ready crystal oscillator and main digital regulator on, all other blocks off ?2 ?ma i spi active spi active state 1.35 ma tune mode current i tune_rx rx tune ? 6.5 ? ma rx mode current i rx ?10 ? ma notes: 1. all specifications guaranteed by production test unless othe rwise noted. production test c onditions and max limits are listed in the "production test conditions" section of "1.1. definition of test conditions" on page 9. 2. guaranteed by qualification. q ualification test conditions are listed in the "qualification test conditions" section in "1.1. definition of test conditions" on page 9.
SI4355 rev 1.0 5 table 3. synthesizer ac electrical characteristics 1 parameter symbol conditions min typ max units synthesizer frequency range f syn 283 ? 350 mhz 425 ? 525 mhz 850 ? 960 mhz synthesizer frequency resolution 2 f res-960 850?960 mhz ?114.4? hz f res-525 425?525 mhz ?57.2? hz f res-350 283?350 mhz ?38.1? hz synthesizer settling time 2 t lock measured from exiting ready mode with xosc running to any frequency, including vco calibration ?130? s notes: 1. all specifications guaranteed by production test unless othe rwise noted. production test c onditions and max limits are listed in the "production test conditions" section in "1.1. definition of test conditions" on page 9. 2. guaranteed by qualification. qualification test conditions are listed in the "qualification test conditions" section in "1.1. definition of test conditions" on page 9. table 4. receiver ac electrical characteristics 1 parameter symbol conditions min typ max units rx frequency range f rx 283 ? 350 mhz 425 ? 525 mhz 850 ? 960 mhz rx sensitivity p rx-_2 (ber < 0.1%) (2.4 kbps, gfsk, bt = 0.5, ? f = ? 30 khz) 2 ,114 khz rx bw ??116?dbm p rx-_40 (ber < 0.1%) (40 kbps, gfsk, bt = 0.5, ? f = ? 25 khz) 2 , 114 khz rx bw ??108?dbm p rx-_128 (ber < 0.1%) (128 kbps, gfsk, bt = 0.5, ? f = ? 70 khz) 2 , 305 khz rx bw ??103?dbm p rx-_ook ber < 0.1%, 1 kbps, 185 khz rx bw, ook, pn15 data ??113?dbm ber < 0.1%, 40 kbps, 185 khz rx bw, ook, pn15 data ??102?dbm rx channel bandwidth 2 bw 40 ? 850 khz notes: 1. all specifications guaran teed by production test unless otherwise noted. production test conditions and max limits are listed in the "production test conditions" section in "1.1. definition of test conditions" on page 9. 2. guaranteed by qualification. qualification test conditions are listed in the "qualif ication test conditions" section in "1.1. definition of test conditions" on page 9.
SI4355 6 rev 1.0 ber variation vs power level 2 p rx_res up to +5 dbm input level ? 0 0.1 ppm rssi resolution res rssi ?0.5?db ? 1-ch offset selectivity 2 c/i 1-ch desired ref signal 3 db above sensitiv- ity, ber < 0.1%. interferer is cw and desired modulated with 1.2 kbps ? f = 5.2 khz gfsk with bt = 0.5, rx bw = 58 khz, channel spacing = 100 khz ? ?56 ? db ? 2-ch offset selectivity 2 c/i 2-ch ? ?59 ? db blocking 200 khz?1 mhz 200k block desired ref signal 3 db above sensitiv- ity, ber < 0.1% interferer is cw and desired modulated with 1.2 kbps ? f = 5.2 khz gfsk with bt = 0.5, rx bw = 58 khz ? ?58 ? db blocking 1 mhz offset 2 1m block ? ?61 ? db blocking 8 mhz offset 2 8m block ? ?79 ? db image rejection 2 im rej rejection at the image frequency. if = 468 khz ? ?40 ? db spurious emissions 2 p ob_rx1 measured at rx pins ? ? ?54 dbm table 5. auxiliary block specifications 1 parameter symbol conditions min typ max units xtal range 2 xtal- range 25 ? 32 mhz 30 mhz xtal start-up time t 30m using xtal and board layout in reference design. start-up time will vary with xtal type and board layout ? 250 ? s 30 mhz xtal cap resolution 3 30m res ?70?ff por reset time t por ??5ms notes: 1. all specifications guaranteed by producti on test unless otherwise noted. production test conditions and max limits are listed in the "production test conditions" section in "1.1. definition of test conditions" on page 9. 2. xtal range tested in production using an external clock source (similar to using a tcxo). 3. guaranteed by qualificati on. qualification test conditions are listed in the "qualification test conditions" section in "1.1. definition of test conditions" on page 9. table 4. receiver ac electrical characteristics 1 (continued) parameter symbol conditions min typ max units notes: 1. all specifications guaran teed by production test unless otherwise noted. production test conditions and max limits are listed in the "production test conditions" section in "1.1. definition of test conditions" on page 9. 2. guaranteed by qualification. qualification test conditions are listed in the "qualif ication test conditions" section in "1.1. definition of test conditions" on page 9.
SI4355 rev 1.0 7 table 6. digital io specifications (gpio_x, sclk, sdo, sdi, nsel, nirq) 1 parameter symbol conditions min typ max units rise time t rise 0.1 x v dd to 0.9 x v dd , c l = 10 pf, drv<1:0>=hh ?2.3? ns fall time t fall 0.9 x v dd to 0.1 x v dd, c l = 10 pf, drv<1:0>=hh ?2?ns input capacitance c in ?2?pf logic high level input voltage v ih v dd x0.7 ? ? v logic low level input voltage v il ??v dd x0.3 v input current i in 0 = ll 2.1 ma i olh drv<1:0> = lh 1.5 ma i ohl drv<1:0> = hl 1.0 ma i ohh drv<1:0> = hh 0.4 ma drive strength for output high level (gpio1, gpio2, gpio3) 2 i oll drv<1:0> = ll 4.5 ma i olh drv<1:0> = lh 3.3 ma i ohl drv<1:0> = hl 2.1 ma i ohh drv<1:0> = hh 0.7 ma drive strength for output high level (gpio0) 2 i oll drv<1:0> = ll 1.9 ma i olh drv<1:0> = lh 1.7 ma i ohl drv<1:0> = hl 1.3 ma i ohh drv<1:0> = hh 0.6 ma logic high level output voltage v oh i out = 500 a v dd x0.8 ? ? v logic low level output voltage v ol i out = 500 a ? ? v dd x0.2 v notes: 1. all specifications guaranteed by qualification. qua lification test conditi ons are listed in the "qualification test conditions" section in "1.1. definition of test conditions" on page 9. 2. gpio output current measured at 3.3 vdc vdd with v oh = 2.7 vdc and v ol =0.66vdc.
SI4355 8 rev 1.0 table 7. thermal characteristics parameter symbol test condition value unit thermal resistance junction to ambient ? ja still air 30 ? c/w junction temperature t j 125 ? c table 8. absolute maximum ratings parameter value unit v dd to gnd ?0.3, +3.6 v voltage on digital control inputs ?0.3, v dd + 0.3 v voltage on analog inputs ?0.3, v dd + 0.3 v rx input power +10 dbm operating ambient temperature range t a ?40 to +85 ? c storage temperature range t stg ?55 to +125 ? c note: stresses beyond those listed under ?absolute maximum rati ngs? may cause permanent damage to the device. these are stress ratings only and functional operation of the device at or beyond these ratings in the operational sections of the specifications is not im plied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. caution: esd sensitive device.
SI4355 rev 1.0 9 1.1. definition of test conditions production test conditions: ?? t a =+25c ?? v dd =+3.3vdc ?? sensitivity measured at 434 mhz using a pn15 modul ated input signal and with packet handler mode enabled. ?? external reference signal (xin) = 1.0 v pp at 30 mhz, centered around 0.8 vdc ?? production test schematic (unless noted otherwise) ?? all rf input and output levels referred to the pins of the SI4355 (not the rf module) qualification test conditions: ?? t a = ?40 to +85 c (typical = 25 c) ?? v dd = +1.8 to +3.6 vdc (typical = 3.3 vdc) ?? using reference design or production test schematic ?? all rf input and output levels referred to the pins of the SI4355 (not the rf module)
SI4355 10 rev 1.0 2. typical applications circuit figure 1. SI4355 applications circuit 30 mhz microcontroller gp1 gp2 gp3 gp4 l1 gnd gpio1 19 18 17 16 1 2 3 4 15 14 13 7 8 9 10 sdi sdo sclk rxn sdn rxp vdd vdd gpio0 xin gpio3 nsel xout gnd 5 nc 6 gnd 20 gpio2 11 12 gp5 c1 SI4355 nirq vdd 100 n c4 100 p c3 1u l2 c2 c5 sdn
SI4355 rev 1.0 11 3. functional description figure 2. SI4355 functional block diagram 3.1. overview the SI4355 is an easy-to-use, size efficient, low current wireless ism receiver that co vers the sub-gh z bands. the wide operating voltage range of 1.8?3.6 v and low current consumption make the SI4355 an ideal solution for battery powered applications. the SI4355 uses a single -conversion mixer to downconvert the fsk/gfsk or ook modulated receive signal to a low if frequency. followi ng a programmable gain amplifier (pga) the signal is converted to the digital domain by a high performance ?? adc allowing filtering, demodu lation, slicing, and packet handling to be perfo rmed in the built-in dsp, increasing the receiv er?s performance and fl exibility versus analog based architectures. the demodulated signal is output to the system mcu through a programmable gpio or via the standard spi bus by reading the 64-byte rx fifo. a high precision local oscillato r (lo) is used and is generated by an integrated vco and ?? fractional-n pll synthesizer. the SI4355 operates in the freque ncy bands of 283?350, 425?525, and 850?960 mhz. additional system features, such as 64 byte rx fifo, preamble detection, sync word detector and crc, reduce overall current consumption, and allow for the use of lo wer-cost system mcus. power-on-reset (por), and gpios further reduce overall system cost and size. the SI4355 is designed to work with an mcu, crystal, and a few passives to create a very co mpact and low-cost system. 3.2. receiver chain the internal low-noise amplifier (lna) is designed to be a wide-band lna that can be matched with three external discrete components to cover any common range of frequen cies in the sub-ghz band. the lna has extremely low noise to suppress the noise of the following stages and achiev e optimal sensitivity; so, no external gain or front-end modules are necessary. the lna has gain control, which is controlled by the internal automatic gain control (agc) algorithm. the lna is followed by an i-q mixer, filter , programmable gain amplifier (pga), and adc. the i-q mixers downconvert the signal to an intermediate frequenc y. the pga then boosts the gain to be within dynamic range of the adc. the adc rejects out-of-band blockers and converts the signal to the digital domain where filtering, demodulation, and processing is performed. peak detectors are in tegrated at the output of the lna and pga for use in the agc algorithm. rx modem synthesizer lna pga adc rx chain spi interface controller battery voltage sensor aux adc 25-32mhz xo sdn rxp rxn vdd gpio0 gpio1 nsel sdi sdo sclk nirq xout xin gpio2 gpio3
SI4355 12 rev 1.0 3.3. receiver modem using high-performance adcs allows cha nnel filtering, image rejection, and demodulation to be performed in the digital domain, which allows for flexib ility in optimizing the device for part icular applications. the digital modem performs the following functions: ?? channel selection filter ?? preamble detection ?? invalid preamble detection ?? rx demodulation ?? automatic gain control (agc) ?? automatic frequency compensation (afc) ?? radio signal strength indicator (rssi) ?? cyclic redundancy check (crc) the digital channel filter and demodulator are opti mized for ultra-low-power consumption and are highly configurable. supported modulation types are gfsk, f sk, and ook. the channel filter can be configured to support bandwidths ranging from 850 khz down to 40 khz. a large variety of data rates are supported ranging from 500 kbps up to 500 kbps. the configurable preamble de tector is used with the synchronous demodulator to improve the reliability of the sync-wor d detection. preamble detection can be skipped using only sync detection, which is a valuable feature of the asynchronous demodul ator when very short preambles are used. the received signal strength indicator (rssi) prov ides a measure of the signal strengt h received on the tuned channel. the resolution of the rssi is 0.5 db. this high-resolutio n rssi enables accurate channel power measurements for clear channel assessment (cca), carrier sense (cs), an d listen before talk (lbt) functionality. a wireless communication channel can be corrupted by noise and interfer ence, so it is important to know if the received data is free of errors. a cyclic redundancy check (crc) is used to detect the presence of er roneous bits in each packet. a crc is computed and appended at the end of each tran smitted packet and verified by the SI4355 receiver to confirm that no errors have occurred. the packet handler and crc can signifi cantly reduce the load on the system microcontroller allowing for a simpler and cheaper microcontroller. the default bandwidth-time product (bt) is 0.5 for all programmed data rates. 3.3.1. received signal strength indicator the received signal strength indicator (rssi) is an estimate of the signal strength in the channel to which the receiver is tuned. the rssi measurement is done after the channel filter, so it is only a measurement of the desired or undesired in-band signal power. the SI4355 us es a fast response register to read rssi and so can complete the read in 16 spi clock cycles with no requirement to wait for ct s. the rssi value is read using the rssi_read command. the rssi value reported by th is api command can be converted to dbm using the following equation: rssical in this formula is dependent on the matching ne twork, modem settings, and external lna gain (if present). it can be obtained through lab measurements using a signal generator connected to the antenna input to provide a known rssi level. without an external lna, the rssical will be approximately 130. 3.4. synthesizer the SI4355 includes an integrated sigma delta ( '6 ) fractional-n pll synthesizer capable of operating over the bands from 283? 350, 425?525, and 850?9 60 mhz. the synthesizer has many advantages; it provides flexibility in choosing data rate, deviation, channel frequency, and channel spacing. the frequency resolution is (2/3)freq_xo/(2 19 ) for 283?350 mhz, freq_xo/(2 19 ) for 425?525 mhz, and freq_xo/(2 18 ) for 850?960 mhz. the nominal reference frequency to the pll is 30 mhz, but any xtal frequency from 25 to 32 mhz may be used. the modem configuration calculat or in wds will automatically account for the xtal frequency being used. the pll utilizes a differential lc vco with inte grated on-chip indu ctors. the output of the vco is followed by a configurable divider, which will divide the signal down to the desired ou tput frequency band. rssi dbm rssi_value 2 -------------------------------- - rssi cal ? =
SI4355 rev 1.0 13 3.4.1. synthesizer frequency control the frequency is set by chan ging the integer and fractio nal settings to the synthesizer. the wds calculator will automatically provide these settings, but the synthesizer equation is shown below for convenience. initial frequency settings are configured in the ezconfig setup and can also be modified using the api commands: freq_control_inte, freq_contro l_frac2, freq_control_frac1, and freq_control_frac0. note: the fc_frac/2 19 value in the above formula must be a number between 1 and 2. the lsb of fc_frac must be "1". 3.4.1.1. ez frequency programming ez frequency programming allows for easily changing radio frequency using a single api command. the base frequency is first set using the ezconfig setup. this base frequency will correspond to channel 0. next, a channel step size is also programmed within the ez config setup. the re sulting frequency will be: the second argument of the start_rx is channel, which sets the channel number for ez frequency programming. for example, if the channel step size is se t to 1 mhz, the base frequen cy is set to 900 mhz, and a channel number of 5 is programmed during the start_ rx command, the resultin g frequency will be 905 mhz. if no channel argument is written as part of the star t_rx command, it will default to the previous value. the initial value of channel is 0 and so will be set to the base frequency if this argument is never used. 3.5. crystal oscillator the SI4355 includes an integrat ed crystal oscillator with a fast start-up time of less than 250 s. the design is differential with the required crystal load capacitanc e integrated on-chip to minimize the number of external components. by default, all that is required off-chip is the crystal. the default crystal is 30 mhz, but the circuit is designed to handle any xtal from 25 to 32 mhz, set in the ezconfig setup. the crystal load capacitance can be digitally programmed to accommodate crystals with va rious load capacitance requirements and to adjust the frequency of the crystal o scillator. the tuning of the crystal load capacitance is pr ogrammed th rough the global_xo_tune api property. the total internal capaci tance is 11 pf and is adjustable in 127 steps (70 ff/step). the crystal frequency adjustment can be used to compensate for crystal production tolerances. the frequency offset characteristics of the ca pacitor bank are demonstrated in figure 3. table 9. output divider (outdiv) values outdiv lower (mhz) upper (mhz) 12 284 350 8 425 525 4 850 960 rf_channel fc_inte fc_frac 2 19 ------------------ + ?? ?? 4 freq_xo ? outdiv ------------------------------ - hz ?? ? rf frequency base frequency ch annel step size ?
SI4355 14 rev 1.0 figure 3. capacitor bank frequency offset characteristics 3.6. battery voltage and auxiliary adc the SI4355 contains an integrated aux iliary 11-bit adc used for the internal ba ttery voltage detect or or an external component via gpio. the effective number of bits (enob) is 9 bits. when measuring external components, the input voltage range is 1 v, and the conversion rate is between 300 hz to 2.44 khz. the adc value is read by first sending the get_adc_reading command and enabling the desired inputs. when the conversion is finished and all the data is ready, cts will go high , and the data can be read out. refe r to application note, ?an691: ezradio api guide?, for details on this command and the formulas needed to interpret the results.
SI4355 rev 1.0 15 4. configuration options and user interface 4.1. ezconfig gui the ezconfig setup gui is part of th e wireless development suite (wds) pr ogram. this setup interface provides an easy path for quickly selecting and loading the desire d configuration for the device. the ezconfig setup allows for three different methods for device setup. one option is the configuration wizard, wh ich easily identifies the optimal setup based on a few questions about the applicat ion. another option is the configuration table, which provides a list of preloaded, common configurations. lastly, ezconfig allows for custom configuration to be loaded using the radio configuration application. after the de sired configuration is selected, the ezconfig setup automatically creates the conf iguration array that will be pa ssed to the chip for setup. the program then gives the option to load a sample project with the selected configur ation onto the evaluation board, or launch ide with the new configuration array preloaded into the user program. fo r more complete information on ezconfig usage, refer to the application note, ?an692: si4x55 programming guide & sample codes?. ? figure 4. device configuration steps open ezconfig setup in wds select configuration from table input method run configuration wizard create custom configuration select freq, power, and packet handler features guided fast manual select action add new configuration to sample code and load on board load configuration on device open ide with configuration array preloaded run sample code lab measurement write new code
SI4355 16 rev 1.0 4.1.1. configuration wizard the configuration wizard is available to easily identify the optimal device se tup based on a few questions about the desired application. within this wizard, the user is able to defin e their system requirements and can see some potential trade-offs for various settings. the wizard then provides a recommended conf iguration that is optimized for the given application. this configuration can be fu rther modified if needed to provide the desired setup. 4.1.2. configuration table the configuration table is a list of predefined config urations that have been optimized for performance and validated by silicon labs. these conf igurations are listed fo r many common application conditions and so most users will be able to find the co nfiguration they need in this table. these configurations are set to provide optimized performance for a given application and can be implemente d with low design risk. once the list item is selected, the specific frequency, and packet handler features can also be applied. 4.1.3. radio configuration application the radio configuration application prov ides an intuitive interf ace for directly modifying the device configuration. using this control panel, the device parameters such as modulation type, data rate, and frequency deviation, can be set. the ezconfig setup then takes these parameters and automatically determines the appropriate device register settings. this meth od allows the user to have complete flexibility in determi ning the configuration of the device without the need to translat e the system requirements into device sp ecific properties. as with the other ezconfig methods, the resulting configuration array is aut omatically generated and available for use in the user's program. 4.2. confi guration options 4.2.1. frequency band the SI4355 can operate in the 283?350 mhz, 425?525 m hz, or 850?960 mhz bands. one of these three bands will be selected during the configuration se tup and then the specific receive freq uency that will be used within this band can be selected. 4.2.2. modulation type the SI4355 can operate using on/off keying (ook), fr equency shift keying (fsk), or gaussian frequency shift keying (gfsk). ook modulation is the most basic modulation type available. it is the most power efficient method and does not require as high oscillator accuracy as fsk. fsk provides the best sensitivity and , therefor e, range performance but gene rally requires more precision fr om the oscillator used . gfsk is a version of fsk where the signal is passed through a gaussian filter, limiting its spectr al width. as a result, the out of band components of the signal are reduced. the SI4355 also has an option for manchester coding. this method provides a state transition at each bit and so allows for more reliable clock recovery. figure 5. manchester code example 11 1 1 1 000 clock data manchester
SI4355 rev 1.0 17 4.2.3. frequency deviation if fsk or gfsk modulation is selected , then a frequency deviat ion will also need to be selected. the frequency deviation is the maximum instantaneous difference betw een the fm modulated frequency and the nominal carrier frequency. the si4455 can operate across a wide range of data rates and frequency deviations. if a frequency deviation needs to be selected, the following guideline might be helpful to build a robust link. a proper frequency deviation is linked to the frequency error between transmi tter and receiver. the frequency error can be calculated using the crystal tolerance parameters and the rf oper ating frequency: (ppm_tx+ppm_rx)*frf/1e-6. for frequency errors below 50 khz, the deviation can be about the same as the frequency error. for frequency errors exceeding 50 khz the frequency deviation can be set to about 0.75 ti mes the frequency error. it is advised to position the modulation index (=2*freq_dev/data_rate) into a range bet ween 1 and 100 for packet handling mode and 2 to 100 for direct mode (non-standard preamble). for example, when in packet handling mode and the frequency error is smaller than data_rate/2, the frequency deviation is set to about data_rate/2. when the frequency error exceeds 100xdata_rate/2, the frequency deviation is preferred to be set to 100xdata_rate/2. 4.2.4. data rate the SI4355 can be set to communicate at between 1 to 500 kbps in (g)fsk mode and between 0.5 to 120 kbps in ook mode. higher data rate s allow for faster data transf er while lower data rates resu lt in improved sensitivity and range performance. 4.2.5. channel bandwidth the channel bandwidth sets the bandwidth for the receiver. since the receiver bandwidth is directly proportional to the noise allowed in th e system, this will normally be set as low as possible. the specific channel bandwidth used will usually be determined based upon the precision of the oscillator and the frequency deviation of the transmitted signal. the ezconfig setup can provide the recommended channel bandwidth based upon these two parameters to help optimize the system. 4.2.6. preamble length a preamble is a defined simple bit sequence used to noti fy the receiver that a data transmission is imminent. the length of this preamble will norm ally be set as short as possible to mini mize power while still insuring that it will be reliably detected given the receiver ch aracteristics, such as duty cycling and packet error rate performance. the SI4355 allows the preamble length to be set between 3 to 255 bytes in length with a default length of 4 bytes. the preamble pattern for the si43 55 will always be 55h with a first bit of "0" if the packet handler capability is used. 4.2.7. sync word length and pattern the sync word follows the preamble in the packet structure and is used to identify the start of the payload data and to synchronize the receiver to the transmitted bit stream. the SI4355 allo ws for sync word lengths of 1 to 4 bytes and the specific pattern can be set within the ezconfig program. the default is a 2 byte length 2d d4 pattern. 4.2.8. cycl ic redundancy check (crc) crc is used to verify that no errors have occurred during transmission and the received packet has exactly the same data as it did when transmitted. if this function is enabled in the SI4355, the last byte of transmitted data must include the crc generated by the transmitter. the SI4355 then performs a crc calculation on the received packet and compares that to the transmitted crc. if these two values are the same, the SI4355 will set an interrupt indicating a valid packet has been received and is wait ing in the rx fifo. if these two crc values differ, the SI4355 will flag an interrupt indicating that a packet er ror occurred. the SI4355 uses crc(16)-ibm: x16+x15+x2+1 with a seed of 0xffff.
SI4355 18 rev 1.0 4.3. configuration commands the ezconfig setup provides all of the code needed for bas ic radio configuration. once the setup is completed in the gui, the program outputs configuration array(s) that can be sent to the radio via the spi interface. no additional setup coding is needed. the configur ation command process is shown in figure 6. the ezconfig_setup passes the configuration array to the device and the ezconfig_check insures that all of the configuration data was written correctly. for more information on the setup commands, refer to application note, ?an691: ezradio api guide?. figure 6. configuration command flowchart ezconfig_setup nop ezconfig_setup ezconfig_check
SI4355 rev 1.0 19 5. controller interface 5.1. serial periph eral interface (spi) the SI4355 communicates with the host mcu over a standard 4-wire serial peripheral interface (spi): sclk, sdi, sdo, and nsel. the spi interface is designed to oper ate at a maximum of 10 mhz. the spi timing parameters are listed in table 10. the host mcu writes data over the sdi pin and can read data from the device on the sdo output pin. figure 7 shows an spi write command. the nsel pin should go low to in itiate the spi command. the first byte of sdi data will be one of the api commands followed by n bytes of parameter data, which will be variable depending on the specific command. the rising edges of sc lk should be aligned with the center of the sdi data. figure 7. spi write command the SI4355 contains an internal mcu which controls a ll the internal functions of the radio. for spi read commands, a typical communication flow of checking clear- to-send (cts) is used to make sure the internal mcu has executed the command and prepared the data to be output over the sdo pin. figure 8 demonstrates the general flow of an spi read command. once the cts val ue reads ffh, the read data is ready to be clocked out to the host mcu. the typical time for a valid ffh cts r eading is 20 s. figure 9 demonstrates the remaining read cycle after cts is set to ffh. the internal mcu will cl ock out the sdo data on the negative edge so the host mcu should process the sdo data on the rising edge of sclk. table 10. serial interface timing parameters symbol parameter min (ns) diagram t ch clock high time 40 t cl clock low time 40 t ds data setup time 20 t dh data hold time 20 t dd output data delay time 20 t en output enable time 20 t de output disable time 50 t ss select setup time 20 t sh select hold time 50 t sw select high period 80 t ch t cl t ds t dh t dd t en t de t ss t sh t sw sclk sdn sdo nsel nsel sdo sdi sclk parambyte n parambyte 0 api command
SI4355 20 rev 1.0 figure 8. spi read command?check cts value figure 9. spi read command?clock out read data readcmdbuff nsel sdo sdi sclk cts send command cts value 0x00 0xff read cts retrieve response response byte 0 nsel sdo sdi sclk response byte n
SI4355 rev 1.0 21 5.2. operating modes and timing the primary states of the SI4355 are shown in figure 10. the shutdown state completely shuts down the radio, minimizing current consumption and is controlled using th e sdn (pin 2). all other states are controlled using the api commands start_rx and change_ state. table 11 shows each of the operating modes with the time required to reach either rx state as well as the curren t consumption of each state. the times in table 11 are measured from the rising edge of nsel until the chip is in the desired state. this information is included for reference only since an automatic sequencer moves the chip from one state to another and so it is not necessary to manually step through each state. most applications will utilize the standby mo de since this provides the fastest transition response time, maintains all register values, and results in nearly the same current consumption as shutdown. figure 10. state machine diagram table 11. operating state response time and current consumption state / mode response time to rx current in state / mode shutdown 30 ms 30 na standby 460 s 50 na spi active 330 s1.35 ma ready 130 s 1.8 ma rx tune 75 s 6.5 ma rx 150 s 10 ma spi active standby ready rx tune rx shutdown config
SI4355 22 rev 1.0 5.2.1. shutdown state the shutdown state is the lowest current consumption stat e of the device and is entered by driving sdn (pin 2) high. in this state, all register contents are lost and ther e is no spi access. to exit this mode, drive sdn low. the device will then initiate a power on reset (por) along with in ternal calibrations. once th is por period is complete, the power_up command is required to in itialize the radio and the configuration can then be loaded into the device. the sdn pin must be held high for at least 10 s before driving it low again to insure the por can be executed correctly. the shutdown state can be used to fully reset the part. 5.2.2. standby state the standby state has similar current consumption to the shut down state but retains all register values, allowing for a much faster response time. because of these benefits, most applications will want to use standby mode rather than shutdown. the standby state is entered by using the change_state api command. while in this state, the spi is accessible but any spi event will au tomatically transition the chip to the spi active state. after the spi event, the host will need to re-command the device to standby mode. 5.2.3. spi active state the spi active state enables the device to process any sp i events, such as api commands. in this state, the spi and boot up oscillator are enabled. the spi active state is entered by using the change_state command or automatically through an spi event while in standby mode . if the spi active state was entered automatically from standby mode, a change_state command will be n eeded to return the dev ice to standby mode. 5.2.4. ready state ready state is designed to give a fast transition time to rx state with minimized current consumption. in this mode the crystal oscillator remains enabled to minimize the transition time. r eady state can be entered using the change_state command. 5.2.5. power on reset a power on reset (por) sequence is used to boot the device up from a fully off or shutdown state. to execute this process, vdd must ramp within 1ms and must remain applied to the device for at least 10ms. if vdd is removed, then it must stay below 0.15v for at least 10ms before being applied again. please see figure x and table x for details. figure 11. por timing diagram
SI4355 rev 1.0 23 5.2.6. rx state the rx state is used whenever the device is required to receive data. it is entered using either the start_rx or change_state commands. with the start_rx command, the next state can be defined to insure optimal timing. when either command is sent to enter rx state, an internal sequencer automatically takes care of all actions required to move between states with no addi tional user commands needed . the sequencer controlled events can include enable the digital an d analog ldos, start up the crystal oscillator, enable pl l, calibrate vco, enable receiver circuits, and enable receive mode. the device will also automa tically set up all receiver features such as packet handling based upon th e initial configuration of the device. table 12. por timing variable description min typ max units t porh high time for vdd to fully settle por circuit. 10 ms t porl low time for vdd to enable por. 10 ms v rrh voltage for successful por. 90%*vdd v v rrl starting voltage for successful por. 0150mv t sr slew rate of vdd for successful por. 1ms
SI4355 24 rev 1.0 5.3. application pr ogramming interface an application programming interface (api) is embedded inside the device and is used for communications with the host mcu. api commands are used to configure the devi ce, control the chip during operation, and retrieve its status. available commands are shown in table 13. the co mplete list of commands and their descriptions are provided in application note, ?an691: ezradio api guide?. table 13. api commands # name description 0x00 nop no operation command 0x01 part_info reports basic information about the device 0x02 power_up boot options and crystal frequency offset 0x10 func_info returns the function revision information of the device 0x11 set_property sets the value of a property 0x12 get_property retrieves the value of a property 0x13 gpio_pin_cfg configures the gpio pins 0x14 get_adc_reading performs and retrieves adc conversion results 0x15 fifo_info provides access to the rx fifo counts and reset 0x19 ezconfig_check validates the ezconf ig array was written correctly 0x20 get_int_status returns the interrupt status byte 0x32 start_rx switches to rx state 0x33 request_device_state request current device state 0x34 change_state changes to a specified device state / mode 0x44 read_cmd_buff used to read cts and the command response 0x50 chip_status_int_pend_read chip_statu s_int_pend fast response register 0x51 modem_int_pend_read modem_int_ pend fast response register 0x53 ph_int_pend_read ph _int_pend fast response register 0x57 rssi_read rssi fast response register 0x66 ezconfig_setup configures de vice using ezconfig array 0x77 read_rx_fifo reads the rx fifo
SI4355 rev 1.0 25 5.4. interrupts the SI4355 is capable of generating an interrupt signal when certain events occur. the chip notifies the microcontroller that an interrupt event has occurred by setting the nirq output pin low = 0. this interrupt signal will be generated when any o ne (or more) of the interrupt events occu r. the nirq pin will remain low until the microcontroller reads the interrupt stat us registers. the nirq output signal will then be reset until the next change in status is detected. the interrupt sources are grouped into three categories: packet handler, chip status, and modem. the individual interrupts in these groups can be enabled/disabled in the interrupt property registers, 0x0101, 0x0102, and 0x0103. an interrupt must be enabled for it to trigger an event on the nirq pin. the interrupt group must be enabled as well as the individual interrupts in api property 0x0100. once an interrupt event occurs and the nirq pin is low the interrupts are read and cleared using the get_int_status command. by default all interrupts will be clear ed once read. the instan taneous status of a specific function may be read if the spec ific interrupt is enabled or disabled. the status results are provided after the interrupts and can be re ad with the same commands as th e interrupts. the status bits will give the current state of the function whether the interrupt is enabled or not. 5.5. gpio four general purpose io (gpio) pins are available for us e in the application. the gpios are configured using the gpio_pin_cfg command. gpio pins 0 and 1 should be used fo r active signals such as data or clock. gpio pins 2 and 3 have more susceptibility to gene rating spurious components in the synt hesizer than pins 0 and 1. the drive strength of the gpios can be adjusted with the gen_ config parameter in the gpio_pin_cfg command. by default, the drive strength is set to the minimum. the default configurat ion and the state of the gpio during shutdown are shown in table 14. for a complete list of the gpio options, please refer to the api guide application note, ?an691: ezradio api guide?. table 14. gpios pin sdn state por default gpio0 0 por gpio1 0 cts gpio2 0 por gpio3 0 por nirq resistive v dd pull-up nirq sdo resistive v dd pull-up sdo sdi high z sdi
SI4355 26 rev 1.0 6. data handling and packet handler 6.1. rx fifo a 64-byte rx fifo is integrat ed into the chip. reading from command register 77h reads data from this rx fifo. 6.2. packet handler the SI4355 includes integrated packet handler features such as preamble and sync word detection as well as crc calculation. this allows the chip to qualify and synchro nize with legitimate transmissions independent of the microcontroller. these features can be enabled using the ezconfig setup. in this setup, the preamble and sync word length can be modified and the sync word pattern can be selected. the general packet structure is shown in figure 12. there is also the option within the ezconf ig setup to select a variable packet length. with this se tting, the receiver is not required to know the packet length ahead of time . the transmitter sends the length of the packet immediately after the sync word. the packet structure for variable length packets is shown in figure 13. figure 12. packet structure for fixed packet length figure 13. packet structure for variable packet length preamble sync word data crc 0 ? 255 bytes 1 ? 4 bytes 1 ? 64 bytes 2 bytes preamble sync word length data crc 0 ? 255 bytes 1 ? 4 bytes 1 byte 1 ? 64 bytes 2 bytes
SI4355 rev 1.0 27 7. pin descriptions pin pin name i/o description 1gndgnd ground 2sdn i shutdown (0 ? v dd v) ? sdn = 1, part will be in shutdown mode and contents of all registers are lost. sdn = 0, all other modes. 3rxp i differential rf receiver input pin 4rxn i differential rf receiver input pin 5nc ? no connect 6gndgnd ground 7v dd v dd supply voltage 8v dd v dd supply voltage 9gndgnd ground 10 gpio0 i/o general purpose digital i/o 11 gpio1 i/o general purpose digital i/o 12 nirq o interrupt status output ? nirq = 0, interrupt event has occurred. read interrupt status for event details. 13 sclk i serial clock input (0 ? v dd v)?provides serial data clock for 4-line serial data bus. 14 sdo o serial data output (0 ? v dd v)? provides serial data readback function of internal control registers. 15 sdi i serial data input (0 ? v dd v)?serial data stream input for 4-line serial data bus 1 2 3 4 5 6 7 8 9 10 16 15 14 13 12 11 20 19 18 17 gnd sdn rxp rxn nc gnd nsel sdi sdo sclk nirq gpio1 vdd vdd gnd gpio0 gpio3 gpio2 xin xout
SI4355 28 rev 1.0 16 nsel i serial interface select input (0 ? v dd v) ? provides select/enable function for 4-line serial data bus 17 xout o crystal oscillator output 18 xin i crystal oscillator input?no dc bias require d, but if used, should be set to 7 v. 19 gpio2 i/o general purpose digital i/o 20 gpio3 i/o general purpose digital i/o pin pin name i/o description
SI4355 rev 1.0 29 8. ordering information part number * description package type operating temperature SI4355-b1a-fm ezradio receiver 3x3 qfn-20 pb-free ?40 to 85 c *note: add an ?r? at the end of the device part number to denote tape and reel option.
SI4355 30 rev 1.0 9. package outline figure 14. 20-pin qfn package
SI4355 rev 1.0 31 table 15. package diagram dimensions dimension min nom max a 0.80 0.85 0.90 a1 0.00 0.02 0.05 a3 0.20 ref b 0.18 0.25 0.30 c 0.25 0.30 0.35 d3 . 0 0 b s c . d2 1.55 1.70 1.85 e0 . 5 0 b s c . e3 . 0 0 b s c . e2 1.55 1.70 1.85 f2 . 4 0 b s c . l 0.30 0.40 0.50 aaa 0.15 bbb 0.10 ccc 0.10 ddd 0.05 eee 0.08 fff 0.10 note: all dimensions shown are in milli meters (mm) unless otherwise noted.
SI4355 32 rev 1.0 10. pcb land pattern figure 15. 20-pin qfn pcb land pattern table 16. pcb land pattern dimensions dimension min max c1 3.00 c2 3.00 e 0.50 ref x1 0.25 0.35 x2 1.65 1.75 y1 0.85 0.95 y2 1.65 1.75 y3 0.37 0.47 f 2.40 ref c 0.25 0.35 note: : all dimensions shown are in mi llimeters (mm) unless otherwise noted.
SI4355 rev 1.0 33 11. top marking 11.1. SI4355 top marking figure 16. SI4355 top marking 11.2. top marking explanation mark method: laser line 1 marking: part number 4355a firmware revision line 2 marking: die revision internal tracking number tttt = trace code line 3 marking: circle = 0.5 mm diameter (bottom-left justified) y = year ww = workweek assigned by the assembly hous e. corresponds to the last significant digit of the year and work week of the mold date.
SI4355 34 rev 1.0 c ontact i nformation silicon laboratories inc. 400 west cesar chavez austin, tx 78701 tel: 1+(512) 416-8500 fax: 1+(512) 416-9669 toll free: 1+(877) 444-3032 please visit the silicon labs technical support web page: https://www.silabs.com/support/pages/contacttechnicalsupport.aspx and register to submit a technical support request. silicon laboratories and silicon labs are trademarks of silicon laboratories inc. other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders. the information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. silicon laboratories assumes no responsibility for errors and omissions, and disclaims responsib ility for any consequences resu lting from the use of information included herein. additionally, silicon laboratorie s assumes no responsibility for the functioning of und escribed features or parameters. silicon laboratories reserves the right to make changes without further notice . silicon laboratories makes no wa rranty, rep- resentation or guarantee regarding the suitability of its products for any particular purpose, nor does silicon laboratories as sume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any an d all liability, including wi thout limitation conse- quential or incidental damages. silicon laborat ories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the silicon laboratories product could create a s ituation where per- sonal injury or death may occur. should buyer purchase or us e silicon laboratories products for any such unintended or unauthor ized ap- plication, buyer shall indemnify and hold silicon laboratories harmless against all claims and damages.

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